AvailableHopper2023

GH200

Grace + Hopper superchip with unified memory. Designed for giant-scale AI and HPC workloads.

Technical Specifications

Architecture
Hopper
Release Year
2023
Process Node
TSMC 4N
Form Factor
Superchip (Grace CPU + Hopper GPU)
VRAM
144 GB HBM3e (or 96 GB HBM3)
Memory Bandwidth
4.8 TB/s (HBM3e)
Interconnect
NVLink 4 (900 GB/s)
FP16 Performance
1,979 TFLOPS (with sparsity)
FP32 Performance
67 TFLOPS
FP64 Performance
34 TFLOPS
TDP
1,000W
CUDA Cores
16,896
Tensor Cores
528
Transistors
80 billion
Die Size
814 mm²

Best Use Cases

  • Large-scale AI training
  • HPC
  • Inference at scale

Quick Facts

FamilyHopper
ArchitectureHopper
Released2023
ProcessTSMC 4N
Form FactorSuperchip (Grace CPU + Hopper GPU)

Related Hopper GPUs

GH200 — Frequently Asked Questions

What is the GH200 GPU used for?

The GH200 is best suited for: Large-scale AI training, HPC, Inference at scale.

How much VRAM does the GH200 have?

The GH200 has 144 GB HBM3e (or 96 GB HBM3) of VRAM.

What is the memory bandwidth of the GH200?

The GH200 has a memory bandwidth of 4.8 TB/s (HBM3e).

What interconnect does the GH200 use?

The GH200 uses NVLink 4 (900 GB/s).

When was the GH200 released?

The GH200 was released in 2023.