AvailableHopper • 2023
GH200
Grace + Hopper superchip with unified memory. Designed for giant-scale AI and HPC workloads.
Technical Specifications
Architecture | Hopper |
Release Year | 2023 |
Process Node | TSMC 4N |
Form Factor | Superchip (Grace CPU + Hopper GPU) |
VRAM | 144 GB HBM3e (or 96 GB HBM3) |
Memory Bandwidth | 4.8 TB/s (HBM3e) |
Interconnect | NVLink 4 (900 GB/s) |
FP16 Performance | 1,979 TFLOPS (with sparsity) |
FP32 Performance | 67 TFLOPS |
FP64 Performance | 34 TFLOPS |
TDP | 1,000W |
CUDA Cores | 16,896 |
Tensor Cores | 528 |
Transistors | 80 billion |
Die Size | 814 mm² |
Best Use Cases
- Large-scale AI training
- HPC
- Inference at scale
Quick Facts
FamilyHopper
ArchitectureHopper
Released2023
ProcessTSMC 4N
Form FactorSuperchip (Grace CPU + Hopper GPU)
Related Hopper GPUs
GH200 — Frequently Asked Questions
What is the GH200 GPU used for?
The GH200 is best suited for: Large-scale AI training, HPC, Inference at scale.
How much VRAM does the GH200 have?
The GH200 has 144 GB HBM3e (or 96 GB HBM3) of VRAM.
What is the memory bandwidth of the GH200?
The GH200 has a memory bandwidth of 4.8 TB/s (HBM3e).
What interconnect does the GH200 use?
The GH200 uses NVLink 4 (900 GB/s).
When was the GH200 released?
The GH200 was released in 2023.